Platform Overview
TACTUN is not just a controller — it’s a platform for machinery builders. You define your I/O. We design the controller. Then you build and ship custom applications with our no-code technology.
Modular by Design. Custom by Default.
TACTUN doesn’t sell predefined controller models. We build a custom PCB for each customer based on their machine’s exact I/O requirements — using a modular architecture composed of reusable functional blocks.
Le sélection de happyhugocasino témoigne d’une collaboration étroite avec les meilleurs éditeurs du marché. Des slots innovantes aux classiques du jeu de table, la diversité est au rendez-vous. Les passionnés bénéficient d’une interface pensée pour rendre chaque visite agréable.
Instead of stacking standard modules (like traditional PLCs), we apply a single-board architecture using layout snippets that represent functional groups, forming a custom compact controller PCB that:
- Reduces unnecessary ports or unused components
- Improves cost-efficiency by eliminating overdesign
- Minimizes enclosure size and simplifies installation
Configure. Generate. Deploy.
Alongside the controller, you get access to TACTUN’s no-code environment.
TACTUN controllers run intelligent firmware tightly coupled to your configuration. And with our upcoming Jetson-based variants, edge AI, camera inputs, and robotic capabilities are already on the roadmap.
- Configure control logic, widgets, dashboards, etc.
- Generate Windows applications for each machine
- Manage your fleet, software updates, and analytics
Functional Modules
Pick Only What You Need — We Design the Rest
| Base Modules Core Computing Functionality |
|---|
| B1 – SOM 1: Dual core, 766MHz, 512MB RAM |
| B2 – SOM 1: Dual core, 1,200MHz, 1GB RAM |
| B3 – SOM 1: Dual core, 766MHz, 512MB RAM |
| B4 – SOM 1: Quad core, 1,333MHz, 2GB RAM |
| B5 – SOM 1: Dual core, 1,200MHz, 2GB RAM |
| B6 – SOM 1: CPU – Dual core, 1,200MHz, 2GB RAM; FPGA – XCZU2CG SOM 2: CPU – 6-core Arm® Cortex®-A78AE, 1.7GHz; GPU – 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores, 4GB RAM |
| Measurement Modules Precision measurement modules for sensor data acquisition |
|---|
| S1 – Wheatstone Bridge (32-bit, 10kS/s/ch) |
| S2 – Linear/Rotary Variable Differential Transformer (LVDT/RVDT) |
| S4 – Wheatstone Bridge (24-bit, 60kS/s) |
| S5 – Wheatstone Bridge (24-bit, 1.5MS/s), ICP |
| S6 – Integrated Electronics Piezo-Electric (IEPE) |
| S7 – Thermocouple, RTD, Thermistor |
| Actuator Control Modules Precision control capabilities |
|---|
| M1 – Brushed DC (PWM) / Stepper / Thermoelectric cooler |
| M2 – Piezo (100V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
| Analog Input / Output Modules Core input and output modules for connecting to sensors or other auxiliary devices |
|---|
| AI1.1 – Voltage Inputs (±10V) |
| AI1.2 – Voltage / Current Inputs (±10V / ±24mA) |
| AI1.3 – Voltage Inputs (±10V) |
| AI2 – Voltage Inputs (±12V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
| Digital Input / Output Modules Core input and output modules for connecting digital auxiliary devices |
|---|
| DIO1 – Bidirectional 5V |
| DIO2 – Bidirectional 24V |
| DIO3.1 – Single-Ended Encoder |
| DIO3.2 – Differential Encoder |
| DIO3.3 – SSI / BISS-C (P2P) / Differential Encoder |
| Power Output Modules Power modules to supply external devices |
|---|
| P1.1 – Power Output 5V, 500mA |
| Camera Modules Add vision capabilities to your machine |
|---|
| AUX1 – 2-lane / 4-lane MIPI cameras |
| Audio Modules Add voice control or audio out capabilities to your machine |
|---|
| AUX2 – Audio in / Audio out |
| Wired Communication Modules Connect your machine to other systems and networks |
|---|
| I1 – Ethernet |
| I2 – USB 2.0 Host |
| I3 – MicroSD Card |
| I4 – CAN (ISO 11898-2) |
| I5.1 – RS-232 / RS-485 |
| I5.2 – RS-232 / RS-485 / BISS-C (P2P, Bus) |
| I6.1 – I²C / 1-Wire, SPI |
| I6.2 – I²C / 1-Wire |
| I9 – Secondary Ethernet |
| I10 – USB 3.0 Host |
| Wireless Communication Modules Connect your machine to wireless networks |
|---|
| W1 – MultiRadio Module |
| W2 – Bluetooth Module |
| W3 – Cellular Connectivity GSM/GPRS Module |
| W4 – Cellular Connectivity LTE-M AWS IoT Module |
| W5 – Cellular Connectivity LTE-M/NB-IoT/EGPRS with GNSS Module |
| Base Modules Core Computing Functionality |
|---|
| B1 – SOM 1: Dual core, 766MHz, 512MB RAM |
| B2 – SOM 1: Dual core, 1,200MHz, 1GB RAM |
| B3 – SOM 1: Dual core, 766MHz, 512MB RAM |
| B4 – SOM 1: Quad core, 1,333MHz, 2GB RAM |
| B5 – SOM 1: Dual core, 1,200MHz, 2GB RAM |
| B6 – SOM 1: CPU – Dual core, 1,200MHz, 2GB RAM; FPGA – XCZU2CG SOM 2: CPU – 6-core Arm® Cortex®-A78AE, 1.7GHz; GPU – 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores, 4GB RAM |
| Measurement Modules Precision measurement modules for sensor data acquisition |
|---|
| S1 – Wheatstone Bridge (32-bit, 10kS/s/ch) |
| S2 – Linear/Rotary Variable Differential Transformer (LVDT/RVDT) |
| S4 – Wheatstone Bridge (24-bit, 60kS/s) |
| S5 – Wheatstone Bridge (24-bit, 1.5MS/s), ICP |
| S6 – Integrated Electronics Piezo-Electric (IEPE) |
| S7 – Thermocouple, RTD, Thermistor |
| Actuator Control Modules Precision control capabilities |
|---|
| M1 – Brushed DC (PWM) / Stepper / Thermoelectric cooler |
| M2 – Piezo (100V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
| Analog Input / Output Modules Core input and output modules for connecting to sensors or other auxiliary devices |
|---|
| AI1.1 – Voltage Inputs (±10V) |
| AI1.2 – Voltage / Current Inputs (±10V / ±24mA) |
| AI1.3 – Voltage Inputs (±10V) |
| AI2 – Voltage Inputs (±12V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
| Digital Input / Output Modules Core input and output modules for connecting digital auxiliary devices |
|---|
| DIO1 – Bidirectional 5V |
| DIO2 – Bidirectional 24V |
| DIO3.1 – Single-Ended Encoder |
| DIO3.2 – Differential Encoder |
| DIO3.3 – SSI / BISS-C (P2P) / Differential Encoder |
| Power Output Modules Power modules to supply external devices |
|---|
| P1.1 – Power Output 5V, 500mA |
| Camera Modules Add vision capabilities to your machine |
|---|
| AUX1 – 2-lane / 4-lane MIPI cameras |
| Audio Modules Add voice control or audio out capabilities to your machine |
|---|
| AUX2 – Audio in / Audio out |
| Wired Communication Modules Connect your machine to other systems and networks |
|---|
| I1 – Ethernet |
| I2 – USB 2.0 Host |
| I3 – MicroSD Card |
| I4 – CAN (ISO 11898-2) |
| I5.1 – RS-232 / RS-485 |
| I5.2 – RS-232 / RS-485 / BISS-C (P2P, Bus) |
| I6.1 – I²C / 1-Wire, SPI |
| I6.2 – I²C / 1-Wire |
| I9 – Secondary Ethernet |
| I10 – USB 3.0 Host |
| Wireless Communication Modules Connect your machine to wireless networks |
|---|
| W1 – MultiRadio Module |
| W2 – Bluetooth Module |
| W3 – Cellular Connectivity GSM/GPRS Module |
| W4 – Cellular Connectivity LTE-M AWS IoT Module |
| W5 – Cellular Connectivity LTE-M/NB-IoT/EGPRS with GNSS Module |