TACTUN doesn’t sell predefined controller models. We build a custom PCB for each customer based on their machine’s exact I/O requirements — using a modular architecture composed of reusable functional blocks.
Instead of stacking standard modules (like traditional PLCs), we apply a single-board architecture using layout snippets that represent functional groups, forming a custom compact controller PCB that:
Alongside the controller, you get access to TACTUN’s no-code environment.
TACTUN controllers run intelligent firmware tightly coupled to your configuration. And with our upcoming Jetson-based variants, edge AI, camera inputs, and robotic capabilities are already on the roadmap.
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Base Modules
Core Computing Functionality
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| B1 - SOM 1: Dual core, 766MHz, 512MB RAM |
| B2 - SOM 1: Dual core, 1,200MHz, 1GB RAM |
| B3 - SOM 1: Dual core, 766MHz, 512MB RAM |
| B4 - SOM 1: Quad core, 1,333MHz, 2GB RAM |
| B5 - SOM 1: Dual core, 1,200MHz, 2GB RAM |
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B6 - SOM 1: CPU - Dual core, 1,200MHz, 2GB RAM; FPGA - XCZU2CG SOM 2: CPU - 6-core Arm® Cortex®-A78AE, 1.7GHz; GPU - 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores, 4GB RAM |
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Measurement Modules
Precision measurement modules for sensor data acquisition
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| S1 – Wheatstone Bridge (32-bit, 10kS/s/ch) |
| S2 – Linear/Rotary Variable Differential Transformer (LVDT/RVDT) |
| S4 – Wheatstone Bridge (24-bit, 60kS/s) |
| S5 – Wheatstone Bridge (24-bit, 1.5MS/s), ICP |
| S6 – Integrated Electronics Piezo-Electric (IEPE) |
| S7 – Thermocouple, RTD, Thermistor |
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Actuator Control Modules
Precision control capabilities
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| M1 – Brushed DC (PWM) / Stepper / Thermoelectric cooler |
| M2 – Piezo (100V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
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Analog Input / Output Modules
Core input and output modules for connecting to sensors or other auxiliary devices
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| AI1.1 – Voltage Inputs (±10V) |
| AI1.2 – Voltage / Current Inputs (±10V / ±24mA) |
| AI1.3 – Voltage Inputs (±10V) |
| AI2 – Voltage Inputs (±12V) |
| AO1.1 – Current Outputs (±100mA, ±50mA) |
| AO1.2 – Voltage / Current Outputs (±10V / ±24mA) |
| AO2 – Voltage Outputs (±10V, 100kS/s) |
| AO3 – Voltage Outputs (±10V, 768kS/s) |
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Digital Input / Output Modules
Core input and output modules for connecting digital auxiliary devices
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| DIO1 – Bidirectional 5V |
| DIO2 – Bidirectional 24V |
| DIO3.1 – Single-Ended Encoder |
| DIO3.2 – Differential Encoder |
| DIO3.3 – SSI / BISS-C (P2P) / Differential Encoder |
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Power Output Modules
Power modules to supply external devices
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| P1.1 – Power Output 5V, 500mA |
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Camera Modules
Add vision capabilities to your machine
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| AUX1 – 2-lane / 4-lane MIPI cameras |
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Audio Modules
Add voice control or audio out capabilities to your machine
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| AUX2 – Audio in / Audio out |
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Wired Communication Modules
Connect your machine to other systems and networks
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| I1 – Ethernet |
| I2 – USB 2.0 Host |
| I3 – MicroSD Card |
| I4 – CAN (ISO 11898-2) |
| I5.1 – RS-232 / RS-485 |
| I5.2 – RS-232 / RS-485 / BISS-C (P2P, Bus) |
| I6.1 – I²C / 1-Wire, SPI |
| I6.2 – I²C / 1-Wire |
| I9 – Secondary Ethernet |
| I10 – USB 3.0 Host |
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Wireless Communication Modules
Connect your machine to wireless networks
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| W1 – MultiRadio Module |
| W2 – Bluetooth Module |
| W3 – Cellular Connectivity GSM/GPRS Module |
| W4 – Cellular Connectivity LTE-M AWS IoT Module |
| W5 – Cellular Connectivity LTE-M/NB-IoT/EGPRS with GNSS Module |
